Casa scp 0079

Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression - ScienceDirect

Por um escritor misterioso

Last updated 28 março 2025

Influence of grain boundary segregation on microscale strengthening of Cu bicrystals

PDF) Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions

Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size - ScienceDirect

Research Nuclear Materials Group

Multi-scale plasticity homogenization of Sn–3Ag-0.5Cu: From β-Sn micropillars to polycrystals with intermetallics - ScienceDirect

Microstructural evolution and deformation behavior of Al-Cu alloys: A Transmission X-ray Microscopy (TXM) and micropillar compression study - ScienceDirect

Size dependent strength, slip transfer and slip compatibility in nanotwinned silver - ScienceDirect

Deformation Twinning Arising in Single-Crystal, Bicrystal and Polycrystal on Commercially Pure Titanium Plate

Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder - ScienceDirect

OpenKIM · EAM Dynamo ZhouJohnsonWadley 2004NISTretabulation Al MO_060567868558_000 MO_060567868558 · Interatomic Potentials and Force Fields

Research Nuclear Materials Group

Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression - ScienceDirect

PDF) The unusual size effect of eutectic Sn/Pb alloys in the micro regime: Experiments and modeling

Recomendado para você