Microscope image of electromigration-induced hillock and void

Mitigating Electromigration in Chip Design

The electromigration effect revisited: non-uniform local tensile stress-driven diffusion. - Abstract - Europe PMC

The electromigration effect revisited: non-uniform local tensile stress-driven diffusion

Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library

Microscope image of electromigration-induced hillock and void

The electromigration effect revisited: non-uniform local tensile stress-driven diffusion

PDF) Appreciating Digital Materials for Longevous Computational Artifacts

PDF) Hillock formation during electromigration in Cu and Al thin films: Three‐dimensional grain growth

Materials, Free Full-Text

Microscope image of electromigration-induced hillock and void

Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration, Journal of Materials Research